NEW DELHI: Union Minister for Electronics and Information Technology Ashwini Vaishnaw on Friday, November 6, launched the Semicon 2.0 Web Application Portal under the Semicon India Programme, marking a major step towards strengthening India’s domestic semiconductor manufacturing ecosystem.
The newly launched portal will facilitate applications under Pillars 2, 3 and 4 of the Semicon 2.0 programme. The initiative aims to expand India’s capabilities in semiconductor equipment and materials, chip fabrication and advanced packaging, while reducing dependence on foreign supply chains.
The launch also coincided with the announcement of 12 additional approvals under the Electronics Components Manufacturing Scheme (ECMS), reflecting the government’s broader push to strengthen domestic electronics manufacturing.
Applications Open Under Three Key Pillars
With the launch of the web application portal, applications are now open for three important areas of the semiconductor industry.
These include:
- Pillar 2 – Machines and Materials: Supporting companies involved in manufacturing semiconductor equipment, materials, chemicals and gases required for chip production.
- Pillar 3 – Setting Up More Fabs: Encouraging investments in semiconductor fabrication facilities, including silicon, compound semiconductor and other specialised fabs.
- Pillar 4 – Strengthening the ATMP/OSAT Industry: Expanding semiconductor assembly, testing, marking and packaging capabilities and attracting advanced packaging technologies.
The portal provides an interactive interface designed to help applicants access relevant information and navigate the application process. Its features include guidelines and notifications, quick links to the six programme pillars, live announcements and dedicated login and registration facilities.
The platform is expected to provide industry stakeholders with a centralised digital channel for accessing information and submitting applications under the programme.
Semicon 2.0: A ₹1.27 Lakh Crore Initiative
The Union Cabinet approved Semicon 2.0 in July 2026 with a total financial outlay of ₹1,27,500 crore under the India Semiconductor Mission (ISM).
The programme is designed to build a comprehensive semiconductor ecosystem in India rather than limiting domestic capabilities to chip assembly and packaging.
It is structured around six strategic pillars: chip design, machines and materials, setting up more fabrication units, strengthening the ATMP/OSAT industry, research and development, and talent development.
While Semicon 1.0 focused on establishing the initial manufacturing foundation, the second phase aims to expand the entire value chain, from chip design and manufacturing equipment to advanced packaging and research.
The initiative also seeks to strengthen India’s position in the global semiconductor industry by encouraging technological innovation, attracting investments and developing skilled professionals.
Government Announces 12 More ECMS Approvals
Alongside the portal launch, the government announced 12 additional approved applications under the Electronics Components Manufacturing Scheme.
These projects involve a projected investment of ₹7,503 crore and are expected to generate production worth ₹39,045 crore. They are also expected to create approximately 7,127 direct employment opportunities.
The newly approved projects cover 10 target product segments, including multi-layer printed circuit boards (PCBs), relays, heat sinks, specialty ceramics, copper foil, anode materials, cathode active materials, polypropylene film, camera rims and capital goods.
The projects will be distributed across seven states: Gujarat, Karnataka, Madhya Pradesh, Maharashtra, Punjab, Tamil Nadu and Uttar Pradesh.
With these additional approvals, the total number of approved applications under ECMS has reached 118, covering 34 products across 16 states. The cumulative projected investment has increased to ₹77,051 crore, with expected production of ₹5,73,146 crore and direct employment opportunities for 81,755 people.
Focus on Domestic Manufacturing and MSMEs
Addressing the gathering, Vaishnaw highlighted India’s transition from assembling finished electronic products towards manufacturing modules, components, materials and advanced technologies.
He pointed to the country’s growing capabilities in areas such as battery cells, copper foils, copper-clad laminates and high-end printed circuit boards.
The minister also emphasised the importance of strengthening domestic supply chains and creating opportunities for micro, small and medium enterprises (MSMEs). According to the government, nearly 50 per cent of the units approved under the ECMS belong to the MSME sector.
He further highlighted the need to attract at least three major semiconductor equipment manufacturers and five companies specialising in chemicals and gases to India.
Strengthening India’s Position in the Global Semiconductor Market
Semiconductors are essential components of modern technologies, powering smartphones, computers, artificial intelligence systems, electric vehicles, telecommunications, defence equipment and several other industries.
India’s growing demand for electronic products has increased the importance of developing domestic semiconductor manufacturing capabilities.
The launch of the Semicon 2.0 portal is intended to provide industries with an opportunity to participate in this expanding ecosystem. By encouraging investment in equipment, materials, fabrication and packaging, the programme aims to address critical gaps in the domestic supply chain.
However, building a globally competitive semiconductor industry will require sustained investment, advanced technological expertise, research capabilities and a skilled workforce.
The launch of the portal, alongside the latest ECMS approvals, marks another step in India’s effort to move beyond electronics assembly and establish itself as a significant player in the global semiconductor value chain.
